Integrating Computational Materials Science and Engineering

The aim of this Gordon Conference is to explore recent progress in use of computational materials models to unify the science and engineering of metallic materials. Integrated Computational Materials Engineering (ICME), also known as Through Process Modeling, is a new and potentially transformational discipline within the materials profession and will form an essential part of this discussion. The topic of a 2008 US National Academy Study and a number of government and industry sponsored R&D programs, ICME involves the development and utilization of material models which capture fundamental insights and quantitative processing-structure-property relationships for use by the engineering community. Key advances in quantification of processing-microstructure and microstructure-property relationships of advanced structural alloys and thermal barrier coatings will be highlighted. Advanced computational techniques such as those linking ab initio calculations to phase equilibria and microstructure will be covered. Experimental activities are central to the development of quantitative processing-structure-property relationships and advanced experimental characterization tools will also be a focus. An aim of this conference is to foster a deep discussion advancing our understanding of the current capability and challenges for vertical integration of this knowledge and its application in aerospace, automotive, power generation and other industries. This conference is designed to benefit those on the forefront of development and application of computational materials models in industry and to those involved at the leading edge of computational and experimental materials science. Students are especially encouraged to attend. In addition to the program of invited presentations poster sessions are planned.

Rapporteurs: Carole Handwerker (Purdue U), Baicheng Liu, Wayne Jones (U Michigan), John Perepezko (U Wisconsin), Lyle Schwartz (AFOSR ret.), and Ed Starke (U Virginia).